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Anisotropic conductive film ACF

Anisotropic conductive film (ACF) is a special coating material that has the functions of unidirectional conductivity and adhesive fixation. This type of film has a protective film on both the top and bottom to protect the main components. When using, first remove the cover film, attach the anisotropic conductive adhesive film to the electrode of the substrate, and then remove the other layer of PET base film as well. After precise alignment, press the upper object onto the lower plate, heat and apply pressure for a period of time to solidify the insulating adhesive material, and finally form a stable structure with vertical conductivity and horizontal insulation.

Image sensor camera specific conductive adhesive

2024-05-29

Model: CP Series Product Features: ACF for solderless connections connects components with fine pitch circuits (such as image sensors) to substrates with low-temperature thermal compression bonding instead of solder. Width 2MM-30MM customizable project unit CP series application - solderless connection film with minimum contact area μ m2 30000 minimum space μ m 100 overlap conditions temperature ° C 120~time seconds 10~pressure MPa 1~Compared with standard solder electroplating methods, it is only packaged by pasting and hot pressing bonding, and the number of processes is greatly reduced, used for fine pitch circuit connections.

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Film On Plastics (ACF)CP923CM-25AC

2024-05-29

Model: CP923CM-25AC/CP923AM-18AC Product Features: Can be connected with thin electrodes and fine pitch. Excellent adhesion to plastic materials. Adopting thermosetting resin of acrylic acid. It has excellent repairability and can be pressed at low temperatures for a short period of time. Suitable for thin film materials that are easily affected by heat.

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Glass Touch Panel Glass and Film Material (ACF) CP806AM-16AC

2024-05-29

Model: CP806AM-16AC Product Features: Suitable for electrode connection between glass substrate and thin film material of touch panel. Specially developed thermosetting resin components have excellent adhesion and are suitable for 2-layer and 3-layer FPCs.

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Film On Board/Film(ACF)CP801AM-35AC

2024-05-29

Model: CP801AM-35AC Product Features: By switching from connector connection to ACF connection, the product achieves thinning and fine pitch, and contributes to the thinning and miniaturization of components and other parts.

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FPD's Film On Glass (ACF) CP133 series

2024-05-29

型号:CP133系列 产品特性:经专门研发的热固性树脂成分具有优异粘合性,适用于2层、3层的FPC。通过使用我公司自主开发的绝缘层的粒子,使产品拥有优异的传导特性以及端子间绝缘特性,并能够实行细间距(Fine pitch)连接。   型号 CP133系列 PAF700系列 型 FOG FOG/FOP 可对应被贴材料 TCP/COF/FPC COF 玻璃基板 玻璃基板/柔性电路板 可对应最小电极间距[µm]※1 25 5 可对应最小接触面积[µm2] ※2 12,000 1,000~1,500 厚度[µm] 18, 25 10 导电粒子 种类 镀镍树脂粒子 镀镍树脂粒子 粒子直径[µm…

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CHIP ON GLASS with anisotropic conductive film (ACF) PAF400 series

2024-02-27

通过把导电粒子整列在预想位置的“粒子整列技术”、以及抑制接合时导电粒子流动的“粒子固定化技术”,以少量粒子实现稳定的粒子捕捉性能。通过减少导电粒子,并进行固定化降低细间距连接时发生短路的风险。在IC和面板连接中,实现最小连接面积720μm2、可对应最小间距8μm。   型号 PAF400系列 工艺 COG/GOP 可对应被贴材料 IC OLED 玻璃基板/柔性电路板 可对应最小电极间距[µm]※1 8 可对应最小接触面积[µm2]※2 720 厚度[µm] 10 导电粒子 种类 镀镍树脂粒子 粒子直径[µmФ] 3.0 镀上绝缘层粒子 ○ 本压着条件 温度[℃] 190~230 时间…

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适用于中小型FPD的Chip On Glass用异方性导电膜(ACF)PAF300系列

2024-02-27

通过把导电粒子整列在预想位置的“粒子整列技术”、以及抑制接合时导电粒子流动的“粒子固定化技术”,以少量粒子实现稳定的粒子捕捉性能。通过减少导电粒子,并进行固定化降低细间距连接时发生短路的风险。在IC和面板连接中,实现最小连接面积400μm2、可对应最小间距5μm。可对应产品宽度1.0mm   型号 PAF300系列 工艺 COG 可对应被贴材料 IC LCD 玻璃基板 可对应最小电极间距[µm]※1 5 可对应最小接触面积[µm2]※2 400 厚度[µm] 16 导电粒子 种类 镀镍树脂粒子 粒子直径[µmФ] 3.2 镀上绝缘层粒子 ○ 本压着条件 温度[℃] 130~160 时…

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