Image sensor camera specific conductive adhesive
Model: CP Series Product Features: ACF for solderless connections connects components with fine pitch circuits (such as image sensors) to substrates with low-temperature thermal compression bonding instead of solder. Width 2MM-30MM customizable project unit CP series application - solderless connection film with minimum contact area μ m2 30000 minimum space μ m 100 overlap conditions temperature ° C 120~time seconds 10~pressure MPa 1~Compared with standard solder electroplating methods, it is only packaged by pasting and hot pressing bonding, and the number of processes is greatly reduced, used for fine pitch circuit connections.
